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EU RoHS: Full List of Exemptions

The European RoHS Directive (2002/95/EC), which restricts the use of certain hazardous substances in electrical and electronic equipment, has been in force since 2004.

However, exemptions on the use of chemicals in certainproducts have been put in place because their componentscontain hazardous substances that it would be technically or scientifically impracticable to prohibit at present. In thepast year, the European Commission had published a number of exemptions, including exemptions on the use of lead, cadmium, mercury and hexavalent chromium for specific purposes.

There are currently 38 exemptions listed in the RoHs Directive. The following table provides you with a handy reference to these exemptions and to their application and

scope.

欧盟RoHS指令（2002/95/EC）于2004开始执行，限制在电子电气设备中使用铅、汞、镉、六价铬、多溴联苯（PBB）和多溴二苯醚（PBDE）六种有害物质。

由于在电子电气行业中，部分禁用的材料现在还没有适用的替代品，因此它们在一定范围内可以获得豁免。近年来，欧盟已经陆续颁布了一系列的豁免条款，包括：在特定用途下铅，镉，汞，鉻的豁免。

至今RoHS指令中已经有37条豁免条款。为方便您的查询,我们为您制作了完整豁免清单供您参考，请见下表：

Exemptions on the use of Lead (Pb)：

铅（Pb）豁免条款：

Exempted Chemicals 豁免物质		Specific Usage 特定用途	RoHS Exemption/ Restriction RoHS豁免/限制	Directive 指令
1	Lead	Glass in cathode ray tubes, electronic components and fluorescent tubes 阴极射线管、电子部件和发光管的玻璃内的铅含量	Exempted	2002/95/EC
2	Lead	Allowable lead limit in alloying element, such as: - Steel: up to 0,35% lead by weight - Aluminium: up to 0,4% lead by weight - Copper alloy: up to 4% lead by weight 铅作为合金元素在钢合金中达0.35%，铝合金中达0.4%和铜合金中达4%	Restricted	2002/95/EC
3	Lead	Shells and bushes made of lead-bronze 青铜轴承外壳和衬套中的铅	Exempted	2005/717/EC
4	Lead	High melting temperature type solders (i.e.lead-based alloys containing 85% by weight or more lead) 高熔点类型焊料中的铅（即：含铅超过85%的铅合金）	Exempted	2005/747/EC
5	Lead	Solders - for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, trans- mission and network management for telecommunications 用于服务器、存储器和存储阵列系统的焊料中的铅, 焊料中的铅（用于交换、信号和传输，以及电信网络管理的网络基础设施设备）	Exempted	2005/747/EC
6	Lead	Electronic ceramic parts 电子陶瓷零部件中的铅	Exempted	2005/747/EC
7	Lead	Compliant pin connector systems 连接器系统顺应针中使用的铅	Exempted	2005/747/EC
8	Lead	Coating material for thermal conduction module c-ring C型环导热模块涂层材料中的铅	Exempted	2005/747/EC
9	Lead and Cadmium	Optical and filter glass 光学玻璃及滤光玻璃中所用的铅及镉	Exempted	2005/747/EC
10	Lead	Solders for the pins and the package of microprocessor - lead content of more than 80% and less than 85% by weight 用以连接插脚和微处理器封装的复合焊料中的铅，并且铅的浓度在80-85%之间	Exempted	2005/747/EC
11	Lead	Solders for electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages 集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅	Exempted	2005/747/EC
12	Lead	Linear incandescent lamps with silicate coated tubes 线形白炽灯硅酸盐涂层灯管中的铅	Exempted	2005/310/EC
13	Lead	Radiant agent in High Intensity Discharge (HID) lamps for professional reprography applications 在专业复印应用的高强度气体放电灯（HID）中作为发光介质的卤化铅	Exempted	2005/310/EC
14	Lead	-Activator in the fluorescent powder (1% lead by weight or less ) of discharge lamps when used as tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) -Speciality lamps for diazo-printing reprography, lithography, insect traps, and photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb) 当放电灯作为含磷如BSP（BaSi2O5:Pb）的仿日晒灯，或作为含磷（如SMS（Sr,Ba）2MgSi2O7:Pb）的重氮复印、平版印刷、捕虫器、光化学和食品加工过程的专用灯时，放电灯荧光粉中作为触媒剂的铅含量在1%或以下	Exempted	2005/310/EC
15	Lead	- PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam - PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL) 紧凑型节能灯中作为特定成PbBiSn-Hg和 PbInSn-Hg为主要汞齐合金以及 PbSn-Hg为辅助汞齐合金中的铅	Exempted	2005/310/EC
16	Lead	- Glass used for bonding front - Rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs) 液晶显示器中用于连接平面荧光灯前后基质的玻璃中的氧化铅	Exempted	2005/310/EC
17	Lead	Crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC 水晶玻璃中铅含量的限值（参考欧盟指令69/493/EEC附件1、2、3、4类）	Exempted	2006/690/EC
18	Lead and Cadmium	Printing inks for the application of enamels on borosilicate glass 硼硅酸盐玻璃表面瓷釉上印刷油墨中的铅与镉	Exempted	2006/691/EC
19	Lead	-Finishes of fine pitch components (except connectors with a pitch of 0.65 mm or less with NiFe lead frames) -Finishes of fine pitch components (except connectors with a pitch of 0.65 mm or less with copper lead frames) 小螺距零部件表面抛光中的铅（螺距超过0.65mm的连接器中的铅、没有镍铁铅框连接器中的铅、没有铜铅框连接器中的铅不在豁免范围内）	Exempted	2006/691/EC
20	Lead	-Solders: for soldering that is machined through hole discoidal -Planar array ceramic multilayer capacitors 通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅	Exempted	2006/691/EC
21	Lead	-Plasma display panels (PDP), surface conduction electron emitter displays (SED) used in structural elements - Front and rear glass dielectric layer, bus electrode, black stripe, address electrode, barrier ribs, seal frit and frit ring as well as in print pastes 等离子显示屏(PDP)及表面传导式电子发射显示器(SED)的构件所用的氧化铅，比如：玻璃前后介电层、汇流电极、黑条纺（用于彩色显象管）、地址电极、障壁（阻隔壁）、密封釉料、环状釉料以及印墨中的氧化铅	Exempted	2006/691/EC
22	Lead	Glass envelope of Black Light Blue (BLB) lamps （BLB）玻璃封套中的氧化铅	Exempted	2006/691/EC
23	Lead	Solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers 用作高性能（长时间在125分贝或以上）扬声器的传感器中焊料的铅合金	Exempted	2006/691/EC
24	Lead	Soldering materials in mercury free flat fluorescent lamps (e.g. liquid crystal displays, design or industrial lighting). 液晶显示器中用于连接平面荧光灯前后基质的玻璃中的氧化铅	Exempted	2008/385/EC
25	Lead	Seal frit used for making window assemblies for Argon and Krypton laser tubes. 用于氩和氪激光管防护窗组合件的封装玻璃料里的铅的氧化物	Exempted	2008/385/EC
26	Lead	Soldering of thin copper wires of 100 μm diameter and less in power transformers 电力变压器中直径100微米及以下细铜线所用焊料中的铅	Exempted	2009/443/EC
27	Lead	Cermet-based trimmer potentiometer elements 金属陶瓷质的微调电位计中的铅	Exempted	2009/443/EC
28	Lead	Plating layer of high voltage diodes on the basis of a zinc borate glass body 以硼酸锌玻璃体为基础的高压二极管的电镀层的铅	Exempted	2009/443/EC

Exemptions on the use of Cadmium(Cd)

镉（Cd）豁免条款：

Exempted Chemicals 豁免物质		Specific Usage 特定用途	RoHS Exemption/Restriction RoHS豁免/限制：	Directive 指令
29	Cadmium	Electrical contacts and cadmium plating 电气插头和镉电镀	Exempted Except: Applications banned under Directive 91/338/EEC () amending Direc- tive 76/769/EEC (*) which relates to restrictions on the marketing and use of certain dangerous substances and preparations. 根据修改关于限制特定危险物质和预制品销售和使用的第76/769/EEC号指令的第91/338/EEC号指令禁止以外的镉电镀；	2005/747/EC
30	Cadmium	Electrical/mechanical solder for electrical conductors located on the voice coil in transducers of high- Powered loudspeakers with sound pressure levels of 100 dB (A) and more 用于位于音量大于或等于100分贝的大功率扩音器音圈上的电导体的电气或机械焊点的镉合金	Exempted	2008/385/EC
31	Cadmium	Thick film pastes on aluminium bonded beryllium oxide 用氧化铍连接铝制成的厚膜浆料中镉和氧化镉	Exempted	2009/443/EC

Exemptions on the use of Mercury(Hg)：

汞（Hg）豁免条款：

Exempted Chemicals 豁免物质		Specific Usage 特定用途	RoHS Exemption/ Restriction RoHS豁免/限制：	Directive 指令
32	Mercury	Compact fluorescent lamps (not exceeding 5 mg per lamp) 小型日光灯中的汞含量不得超过5 毫克/灯	Exempted	2002/95/EC
33	Mercury	Straight fluorescent lamps for general purposes, but not exceeding: -Halophosphate (10 mg) -Triphosphate with normal lifetime (5 mg) -Triphosphate with long lifetime (8 mg) 一般用途的直管日光灯中的汞含量不得超过： -盐磷酸盐 10毫克 -正常的三磷酸盐 5毫克 -长效的三磷酸盐 8毫克	Restricted	2002/95/EC
34	Mercury	Straight fluorescent lamps for special purposes 特殊用途的直管日光灯中的汞含量	Exempted	2002/95/EC
35	Mercury	Lamps not specifically mentioned in 2002/95/EC 2002/95/EC中未特别提及的其它照明灯中的汞含量	Exempted	2002/95/EC
36	Mercury	Cathode sputtering inhibitor in DC plasma displays in contents up to 30 mg per display 2010年7月1日前直流等离子显示器中阴极溅射抑制剂中的汞，其含量不得超过30毫克/显示器	Exempted until 1 July 2010	2009/443/EC

Exemptions on the use of Hexavalent Chromium(Cr)：

六价鉻（CrVI）豁免条款：

Exempted

Chemicals

豁免物质

Specific Usage

特定用途

RoHS

Exemption/

Restriction

RoHS豁免/限制：

Directive

法规

Hexavalent Chromium

Anti-corrosion for carbon steel cooling

system in absorption refrigerators

在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬

Exempted

2002/95/EC

发布日期：[ 2010-05-13 ]

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