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EU RoHS: Full List of Exemptions

The European RoHS Directive (2002/95/EC), which restricts the use of certain hazardous substances in electrical and electronic equipment, has been in force since 2004.

However, exemptions on the use of chemicals in certainproducts have been put in place because their componentscontain hazardous substances that it would be technically or scientifically impracticable to prohibit at present. In thepast year, the European Commission had published a number of exemptions, including exemptions on the use of lead, cadmium, mercury and hexavalent chromium for specific purposes.

There are currently 38 exemptions listed in the RoHs Directive. The following table provides you with a handy reference to these exemptions and to their application and

scope.

歐盟RoHS指令（2002/95/EC）於2004開始執行，限制在電子電氣設備中使用鉛、汞、鎘、六價鉻、多溴聯苯（PBB）和多溴二苯醚（PBDE）六種有害物質。

由於在電子電氣行業中，部分禁用的材料現在還沒有適用的替代品，因此它們在一定范圍內可以獲得豁免。近年來，歐盟已經陸續頒布了一系列的豁免條款，包括：在特定用途下鉛，鎘，汞，鉻的豁免。

至今RoHS指令中已經有37條豁免條款。為方便您的查詢,我們為您制作了完整豁免清單供您參考，請見下表：

Exemptions on the use of Lead (Pb)：

鉛（Pb）豁免條款：

Exempted Chemicals 豁免物質		Specific Usage 特定用途	RoHS Exemption/ Restriction RoHS豁免/限制	Directive 指令
1	Lead	Glass in cathode ray tubes, electronic components and fluorescent tubes 陰極射線管、電子部件和發光管的玻璃內的鉛含量	Exempted	2002/95/EC
2	Lead	Allowable lead limit in alloying element, such as: - Steel: up to 0,35% lead by weight - Aluminium: up to 0,4% lead by weight - Copper alloy: up to 4% lead by weight 鉛作為合金元素在鋼合金中達0.35%，鋁合金中達0.4%和銅合金中達4%	Restricted	2002/95/EC
3	Lead	Shells and bushes made of lead-bronze 青銅軸承外殼和襯套中的鉛	Exempted	2005/717/EC
4	Lead	High melting temperature type solders (i.e.lead-based alloys containing 85% by weight or more lead) 高熔點類型焊料中的鉛（即：含鉛超過85%的鉛合金）	Exempted	2005/747/EC
5	Lead	Solders - for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, trans- mission and network management for telecommunications 用於服務器、存儲器和存儲陣列系統的焊料中的鉛, 焊料中的鉛（用於交換、信號和傳輸，以及電信網絡管理的網絡基礎設施設備）	Exempted	2005/747/EC
6	Lead	Electronic ceramic parts 電子陶瓷零部件中的鉛	Exempted	2005/747/EC
7	Lead	Compliant pin connector systems 連接器系統順應針中使用的鉛	Exempted	2005/747/EC
8	Lead	Coating material for thermal conduction module c-ring C型環導熱模塊塗層材料中的鉛	Exempted	2005/747/EC
9	Lead and Cadmium	Optical and filter glass 光學玻璃及濾光玻璃中所用的鉛及鎘	Exempted	2005/747/EC
10	Lead	Solders for the pins and the package of microprocessor - lead content of more than 80% and less than 85% by weight 用以連接插腳和微處理器封裝的復合焊料中的鉛，並且鉛的濃度在80-85%之間	Exempted	2005/747/EC
11	Lead	Solders for electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages 集成電路倒裝芯片封裝中半導體芯片及載體之間形成可靠聯接所用焊料中的鉛	Exempted	2005/747/EC
12	Lead	Linear incandescent lamps with silicate coated tubes 線形白熾燈硅酸鹽塗層燈管中的鉛	Exempted	2005/310/EC
13	Lead	Radiant agent in High Intensity Discharge (HID) lamps for professional reprography applications 在專業復印應用的高強度氣體放電燈（HID）中作為發光介質的鹵化鉛	Exempted	2005/310/EC
14	Lead	-Activator in the fluorescent powder (1% lead by weight or less ) of discharge lamps when used as tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) -Speciality lamps for diazo-printing reprography, lithography, insect traps, and photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb) 當放電燈作為含磷如BSP（BaSi2O5:Pb）的仿日曬燈，或作為含磷（如SMS（Sr,Ba）2MgSi2O7:Pb）的重氮復印、平版印刷、捕蟲器、光化學和食品加工過程的專用燈時，放電燈熒光粉中作為觸媒劑的鉛含量在1%或以下	Exempted	2005/310/EC
15	Lead	- PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam - PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL) 緊湊型節能燈中作為特定成PbBiSn-Hg和 PbInSn-Hg為主要汞齊合金以及 PbSn-Hg為輔助汞齊合金中的鉛	Exempted	2005/310/EC
16	Lead	- Glass used for bonding front - Rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs) 液晶顯示器中用於連接平面熒光燈前後基質的玻璃中的氧化鉛	Exempted	2005/310/EC
17	Lead	Crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC 水晶玻璃中鉛含量的限值（參考歐盟指令69/493/EEC附件1、2、3、4類）	Exempted	2006/690/EC
18	Lead and Cadmium	Printing inks for the application of enamels on borosilicate glass 硼硅酸鹽玻璃表面瓷釉上印刷油墨中的鉛與鎘	Exempted	2006/691/EC
19	Lead	-Finishes of fine pitch components (except connectors with a pitch of 0.65 mm or less with NiFe lead frames) -Finishes of fine pitch components (except connectors with a pitch of 0.65 mm or less with copper lead frames) 小螺距零部件表面拋光中的鉛（螺距超過0.65mm的連接器中的鉛、沒有鎳鐵鉛框連接器中的鉛、沒有銅鉛框連接器中的鉛不在豁免范圍內）	Exempted	2006/691/EC
20	Lead	-Solders: for soldering that is machined through hole discoidal -Planar array ceramic multilayer capacitors 通孔盤狀及平面陣列陶瓷多層電容器焊料所含的鉛	Exempted	2006/691/EC
21	Lead	-Plasma display panels (PDP), surface conduction electron emitter displays (SED) used in structural elements - Front and rear glass dielectric layer, bus electrode, black stripe, address electrode, barrier ribs, seal frit and frit ring as well as in print pastes 等離子顯示屏(PDP)及表面傳導式電子發射顯示器(SED)的構件所用的氧化鉛，比如：玻璃前後介電層、匯流電極、黑條紡（用於彩色顯象管）、地址電極、障壁（阻隔壁）、密封釉料、環狀釉料以及印墨中的氧化鉛	Exempted	2006/691/EC
22	Lead	Glass envelope of Black Light Blue (BLB) lamps （BLB）玻璃封套中的氧化鉛	Exempted	2006/691/EC
23	Lead	Solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers 用作高性能（長時間在125分貝或以上）揚聲器的傳感器中焊料的鉛合金	Exempted	2006/691/EC
24	Lead	Soldering materials in mercury free flat fluorescent lamps (e.g. liquid crystal displays, design or industrial lighting). 液晶顯示器中用於連接平面熒光燈前後基質的玻璃中的氧化鉛	Exempted	2008/385/EC
25	Lead	Seal frit used for making window assemblies for Argon and Krypton laser tubes. 用於氬和氪激光管防護窗組合件的封裝玻璃料裡的鉛的氧化物	Exempted	2008/385/EC
26	Lead	Soldering of thin copper wires of 100 μm diameter and less in power transformers 電力變壓器中直徑100微米及以下細銅線所用焊料中的鉛	Exempted	2009/443/EC
27	Lead	Cermet-based trimmer potentiometer elements 金屬陶瓷質的微調電位計中的鉛	Exempted	2009/443/EC
28	Lead	Plating layer of high voltage diodes on the basis of a zinc borate glass body 以硼酸鋅玻璃體為基礎的高壓二極管的電鍍層的鉛	Exempted	2009/443/EC

Exemptions on the use of Cadmium(Cd)

鎘（Cd）豁免條款：

Exempted Chemicals 豁免物質		Specific Usage 特定用途	RoHS Exemption/Restriction RoHS豁免/限制：	Directive 指令
29	Cadmium	Electrical contacts and cadmium plating 電氣插頭和鎘電鍍	Exempted Except: Applications banned under Directive 91/338/EEC () amending Direc- tive 76/769/EEC (*) which relates to restrictions on the marketing and use of certain dangerous substances and preparations. 根據修改關於限制特定危險物質和預制品銷售和使用的第76/769/EEC號指令的第91/338/EEC號指令禁止以外的鎘電鍍；	2005/747/EC
30	Cadmium	Electrical/mechanical solder for electrical conductors located on the voice coil in transducers of high- Powered loudspeakers with sound pressure levels of 100 dB (A) and more 用於位於音量大於或等於100分貝的大功率擴音器音圈上的電導體的電氣或機械焊點的鎘合金	Exempted	2008/385/EC
31	Cadmium	Thick film pastes on aluminium bonded beryllium oxide 用氧化鈹連接鋁制成的厚膜漿料中鎘和氧化鎘	Exempted	2009/443/EC

Exemptions on the use of Mercury(Hg)：

汞（Hg）豁免條款：

Exempted Chemicals 豁免物質		Specific Usage 特定用途	RoHS Exemption/ Restriction RoHS豁免/限制：	Directive 指令
32	Mercury	Compact fluorescent lamps (not exceeding 5 mg per lamp) 小型日光燈中的汞含量不得超過5 毫克/燈	Exempted	2002/95/EC
33	Mercury	Straight fluorescent lamps for general purposes, but not exceeding: -Halophosphate (10 mg) -Triphosphate with normal lifetime (5 mg) -Triphosphate with long lifetime (8 mg) 一般用途的直管日光燈中的汞含量不得超過： -鹽磷酸鹽 10毫克 -正常的三磷酸鹽 5毫克 -長效的三磷酸鹽 8毫克	Restricted	2002/95/EC
34	Mercury	Straight fluorescent lamps for special purposes 特殊用途的直管日光燈中的汞含量	Exempted	2002/95/EC
35	Mercury	Lamps not specifically mentioned in 2002/95/EC 2002/95/EC中未特別提及的其它照明燈中的汞含量	Exempted	2002/95/EC
36	Mercury	Cathode sputtering inhibitor in DC plasma displays in contents up to 30 mg per display 2010年7月1日前直流等離子顯示器中陰極濺射抑制劑中的汞，其含量不得超過30毫克/顯示器	Exempted until 1 July 2010	2009/443/EC

Exemptions on the use of Hexavalent Chromium(Cr)：

六價鉻（CrVI）豁免條款：

Exempted

Chemicals

豁免物質

Specific Usage

特定用途

RoHS

Exemption/

Restriction

RoHS豁免/限制：

Directive

法規

Hexavalent Chromium

Anti-corrosion for carbon steel cooling

system in absorption refrigerators

在吸收式電冰箱中作為碳鋼冷卻系統防腐劑的六價鉻

Exempted

2002/95/EC

發布日期：[ 2010-05-13 ]

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